Dynamix DW - 01/S Manuel d'utilisateur télécharger pdf

Document Revision Table

Updated December 2001

Sorted in NUMBER order, ignore all letters

Product ID Document Name Status ANSI DoD

J-STD-001

Requirements for Soldered Electrical and Electronic Assemblies Rev. C 3/00

Rev. B 10/96

Rev. A 1/95

Orig. 4/92; Supersedes IPC-S-815

IPC-HDBK-001

Handbook and Guide to the Requirements for Soldered Electrical

and Electronic Assemblies

Amend. 1 12/00

Orig. 3/98

SMC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch

Technology

Orig. 1/89

IT-WP-001

Myths of E-Commerce Orig. 9/00

SMC-WP-001

Soldering Capability White Paper Report Orig. 8/91

SMC-WP-002

An Assessment of the Use of Lead in Electronic Assembly Orig. 8/92

J-STD-002

Solderability Tests for Component Leads, Terminations, Lugs,

Terminals and Wires

Rev. A 10/98

Orig. 4/92; Supersedes IPC-S-805

SMC-WP-003

Chip Mounting Technology Orig. 8/93

J-STD-003

Solderability Tests for Printed Boards Original 4/92; Supersedes IPC-S-804 Y

SMC-WP-004

Design for Success Orig. 4/97

J-STD-004

Requirements for Soldering Fluxes Amend. 1 4/96

Orig. 1/95 Supersedes IPC-SF-818

SMC-WP-005

PWB Surface Finishes Orig. 4/97

IPC-HDBK-005

Soldering Pastes Handbook Not yet published

J-STD-005

Requirements for Soldering Pastes Amend. 1 1/95

Orig. 1/95 Supersedes IPC-SF-819

J-STD-006A

Requirements for Electronic Grade Solder Alloys and Fluxed and

Non-Fluxed Solid Solders for Electronic Soldering Applications

Rev. A May 01

Orig. 1/95

J-STD-012

Implementation of Flip Chip and Chip Scale Technology Orig. 1/96 Y

J-STD-013

Implementation of Ball Grid Array and Other High Density

Technology

Orig. 7/96 Y

IPC-DRM-18

Component Identification Desk Reference Manual Rev. E 8/00

Rev. D 7/99

Rev. C 7/98

Rev. B 2/97

Rev. A 4/96

Orig. 9/95

J-STD-020

Moisture/Reflow Sensitivity Classification of Plastic Surface Mount

Devices

Rev. A 4/99

Orig. 10/96

J-STD-026

Semiconductor Design Standard for Flip Chip Applications Orig. 8/99

J-STD-027

Mechanical Outline Standard for Flip Chip or Chip Scale

Configurations

Not yet published

J-STD-028

Performance Standard for Flip Chip Scale Bumps Orig. 8/99

J-STD-029

Performance and Reliability Test Methods for Flip Chip, Chip

Scale, BGA, and other Surface Mount Array Package Applications

Not yet published

J-STD-030

Guidelines for Selection, Application of Underfill Material for Flip

Chip and Other Micropackages

Not yet published

J-STD-031

Mechanical Outline Standard for Ball Grid Arrays and other High-

Density Technology

Not yet published

J-STD-032

Performance Standard for Ball Grid Array Bumps and Columns Not yet published

J-STD-033

Packaging and Handling of Moisture Sensitive Non-Hermetic Solid

State Surface Mount Devices

Orig. 4/99 Y

J-STD-035

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic

Components

Orig. 4/99

J-STD-039

Calibration Procedure for Acoustic Microscopy (AM) Not yet published

J-STD-040

Standards Roadmap for Optoelectronic Assembly and Packaging

Technology

Not yet published

1 2 3 4 5 6 ... 10 11

Document Revision Table 1
Amend. 1 10

Résumé du contenu

Page 1 - Document Revision Table

Document Revision TableUpdated December 2001Sorted in NUMBER order, ignore all lettersProduct ID Document Name Status ANSI DoDJ-STD-001Requirements fo

Page 2

Product ID Document Name Status ANSI DoDIPC-4202Flexible Base Dielectrics for Use in Flexible Printed Wiring Not yet published, will supersedeIPC-FC-2

Page 3

Product ID Document Name Status ANSI DoDIPC-7526Stencil and Misprinted Board Cleaning Handbook Not yet publishedIPC-7530Guidelines for Temperature Pro

Page 4

Product ID Document Name Status ANSI DoDIPC-DRM-40Through-Hole Solder Joint Evaluation Desk Reference Manual Rev. D 7/00Rev. C 9/99Rev. B 1/99Rev. A 8

Page 5

Product ID Document Name Status ANSI DoDIPC-SG-141Specification for Finished Fabric Woven from "S" Glass for PrintedBoardsOrig. 2/92IPC-A-14

Page 6

Product ID Document Name Status ANSI DoDIPC-FC-241Flexible Metal-Clad Dielectrics for Use in Fabrication of FlexiblePrinted WiringAmend. 10/95Rev. C 4

Page 7

Product ID Document Name Status ANSI DoDIPC-PD-335Electronic Packaging Handbook Orig. 12/89IPC-NC-349Computer Numerical Control Formatting for Driller

Page 8

Product ID Document Name Status ANSI DoDIPC-TR-483Dimensional Stability Testing of Thin Laminates - Report on PhaseI International Round Robin Test Pr

Page 9

Product ID Document Name Status ANSI DoDIPC-TA-721Technology Assessment Handbook on Multilayer BoardsIPC-TA-722Technology Assessment of SolderingIPC-T

Page 10 - Amend. 1

Product ID Document Name Status ANSI DoDIPC-HM-860Specification for Multilayer Hybrid Circuits Orig. 1/87IPC-TF-870Qualification and Performance of Po

Page 11

Product ID Document Name Status ANSI DoDIPC-2251Design Guidelines for Electronic Packaging Utilizing High SpeedTechniquesNot yet publishedIPC-2252Desi